Title :
Interdiffusion and grain isolation in Co/Cr thin films
Author :
Feng, Y.C. ; Laughlin, D.E. ; Lambeth, D.N.
Author_Institution :
Data Storage Syst. Center, Carnegie Mellon Univ., Pittsburgh, PA, USA
fDate :
11/1/1994 12:00:00 AM
Abstract :
In this work, interdiffusion and grain isolation in Co/Cr films have been investigated by studying the dependence of the magnetic properties on the substrate preheating temperature as well as on post-deposition annealing processes. By choosing pure Co instead of a Co-alloy, the possibility of grain isolation caused by the segregation of solute atoms from within the magnetic layer has been eliminated. It is found that both post-deposition thermal annealing and substrate preheating can effectively increase the isolation of the Co grains
Keywords :
annealing; chemical interdiffusion; chromium; cobalt; coercive force; ferromagnetic materials; grain boundary diffusion; magnetic multilayers; Co/Cr thin films; Cr-Co-Cr; grain isolation; interdiffusion; magnetic properties; post-deposition annealing processes; substrate preheating temperature; thermal annealing; Annealing; Atomic layer deposition; Chromium; Coercive force; Grain boundaries; Magnetic films; Magnetic properties; Magnetic separation; Temperature; Transistors;
Journal_Title :
Magnetics, IEEE Transactions on