DocumentCode :
1199605
Title :
On the use of silicon photonics--Part II
Author :
Sayil, Selahattin
Author_Institution :
Lamar Univ., Beaumont, TX
Volume :
28
Issue :
2
fYear :
2009
Firstpage :
37
Lastpage :
40
Abstract :
For Part I see ibid., vol. 28, no. 1 (2009). With optical input and output devices integrated on chip, chips could be tested in a contactless manner using an easy optical test setup. The contactless optical testing approach can address many challenges associated with increases in the number of physical test probes required to test increasingly complex integrated circuits (ICs).
Keywords :
integrated circuit testing; integrated optoelectronics; light emitting diodes; optical interconnections; Si; VLSI compatible light emitters; chip-chip optical interconnection; contactless functional wafer testing; on/off chip signal transmission; optical contactless testing; silicon LED; silicon light emitting diode; silicon photonics;
fLanguage :
English
Journal_Title :
Potentials, IEEE
Publisher :
ieee
ISSN :
0278-6648
Type :
jour
DOI :
10.1109/MPOT.2008.931577
Filename :
4803814
Link To Document :
بازگشت