Title :
Impact of low-impedance substrate on power supply integrity
Author :
Panda, Rajendran ; Sundareswaran, Savithri ; Blaauw, David
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
Although it is tempting to think of the power grid as an independent medium of the transfer of energy from the package to the devices in the IC, some second-order technology-related effects can sometimes cause unforeseen problems. This article focuses especially on the relationship of the power delivery system to the silicon substrate properties, and shows how a low-impendance substrate can make a substantial difference in the noise generated by the power grid.
Keywords :
VLSI; digital integrated circuits; integrated circuit design; power supply circuits; substrates; VLSI designs; capacitive coupling; delivery system power; digital integrated circuits; impact ionization; low-impedance substrate; power grid; power supply noise; resistive coupling; Acoustical engineering; Capacitance; Impact ionization; Packaging; Power grids; Power supplies; Rails; Semiconductor process modeling; Substrates; Voltage;
Journal_Title :
Design & Test of Computers, IEEE
DOI :
10.1109/MDT.2003.1198681
