• DocumentCode
    1200093
  • Title

    Electrical modeling of integrated-package power and ground distributions

  • Author

    Zheng, Hui ; Pileggi, Lawrence ; Kratiter, B.

  • Author_Institution
    Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    20
  • Issue
    3
  • fYear
    2003
  • Firstpage
    24
  • Lastpage
    31
  • Abstract
    Ensuring reliable power distribution requires accurate modeling of on-package power and ground networks. This, in turn, necessitates efficient magnetic coupling modeling - a massively complex task. Extending their previous work, these authors introduce a window-based extraction technique that uses the physical concept of susceptance to control modeling complexity.
  • Keywords
    CMOS integrated circuits; VLSI; integrated circuit design; integrated circuit modelling; optimisation; reduced order systems; 3D magnetic couplings; CMOS; VLSI; ground distributions; macromodeling; model order reduction; on-package decoupling capacitor optimization; on-package power distributions; susceptance-based simulation; Circuit simulation; Coupling circuits; Inductance; Integrated circuit interconnections; Magnetic susceptibility; Packaging; Power distribution; Power system interconnection; Power system modeling; Sparse matrices;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/MDT.2003.1198682
  • Filename
    1198682
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1200093