Title :
Current criticalities and innovation perspectives in flash memory design automation
Author :
Conci, Armando ; Faldarini, Anna ; Fumagalli, Gaspare ; Girardi, Antonio ; Pesare, Marcello ; Tecli, Nicola ; Zucchinali, Massimo
Author_Institution :
MPG Flash Div., STMicroelectronics, Agrate Brianza, Italy
fDate :
4/1/2003 12:00:00 AM
Abstract :
With reference to technological, architectural, and market considerations, the specific areas of design methodology and automation in flash memory design are analyzed in this paper. For each of the activities identified as critical, we show the design process key constraints and specifications, which drive the change in methodology, tools, and flows. We go through a brief survey of the solutions adopted in the recent past as well as the new emerging areas of intervention. The analysis covers: 1) design methodology, floorplanning, full-custom layout design and Rtl2Layout automation integration; 2) analog-digital mixed full-chip simulation and architectural exploration; 3) statistical analog circuital simulation; 4) mixed-signal design to test approaches; and 5) IC and package design integration.
Keywords :
circuit layout CAD; circuit simulation; design for testability; flash memories; integrated circuit layout; integrated circuit packaging; memory architecture; mixed analogue-digital integrated circuits; IC design integration; Rtl2 layout automation integration; analog-digital mixed full-chip simulation; architectural considerations; architectural exploration; current criticalities; design methodology; design process constraints; flash memory design automation; floorplanning; full-custom layout design; innovation perspectives; market considerations; mixed-signal design to test; package design integration; package signal integrity analysis; statistical analog circuital simulation; Analog-digital conversion; Analytical models; Automatic testing; Circuit simulation; Circuit testing; Design automation; Design methodology; Flash memory; Process design; Technological innovation;
Journal_Title :
Proceedings of the IEEE
DOI :
10.1109/JPROC.2003.811710