• DocumentCode
    1202443
  • Title

    An efficient method for plasma-charging damage measurement

  • Author

    Cheung, K.P.

  • Author_Institution
    AT&T Bell Labs., Murray Hill, NJ, USA
  • Volume
    15
  • Issue
    11
  • fYear
    1994
  • Firstpage
    460
  • Lastpage
    462
  • Abstract
    The initial slope of the voltage versus time curve during constant current stressing of gate-oxide has been demonstrated, for the first time, as a good indicator for plasma-charging damage. This method of damage measurement measures the charge trapping rate of the gate-oxide directly while it is under a high-field stress. It combines the stressing and measuring steps in one rapid measurement. Using only capacitors as testing vehicle, this method does not require extensive processing. Using current stressing instead of CV measurement, this method greatly reduces the measurement time and the size requirement of the capacitor. The ability of this measurement method in bringing out the passivated defects after annealing is demonstrated. An example of using this method in detecting plasma-charging damage is included.<>
  • Keywords
    MOS capacitors; annealing; electron traps; semiconductor device testing; MOS capacitor; annealing; charge trapping rate; constant current stressing; high-field stress; measurement time; passivated defects; plasma-charging damage measurement; testing vehicle; voltage versus time curve; Capacitors; Charge measurement; Current measurement; Plasma materials processing; Plasma measurements; Size measurement; Stress measurement; Testing; Time measurement; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.334667
  • Filename
    334667