DocumentCode
1202443
Title
An efficient method for plasma-charging damage measurement
Author
Cheung, K.P.
Author_Institution
AT&T Bell Labs., Murray Hill, NJ, USA
Volume
15
Issue
11
fYear
1994
Firstpage
460
Lastpage
462
Abstract
The initial slope of the voltage versus time curve during constant current stressing of gate-oxide has been demonstrated, for the first time, as a good indicator for plasma-charging damage. This method of damage measurement measures the charge trapping rate of the gate-oxide directly while it is under a high-field stress. It combines the stressing and measuring steps in one rapid measurement. Using only capacitors as testing vehicle, this method does not require extensive processing. Using current stressing instead of CV measurement, this method greatly reduces the measurement time and the size requirement of the capacitor. The ability of this measurement method in bringing out the passivated defects after annealing is demonstrated. An example of using this method in detecting plasma-charging damage is included.<>
Keywords
MOS capacitors; annealing; electron traps; semiconductor device testing; MOS capacitor; annealing; charge trapping rate; constant current stressing; high-field stress; measurement time; passivated defects; plasma-charging damage measurement; testing vehicle; voltage versus time curve; Capacitors; Charge measurement; Current measurement; Plasma materials processing; Plasma measurements; Size measurement; Stress measurement; Testing; Time measurement; Voltage;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.334667
Filename
334667
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