• DocumentCode
    1202527
  • Title

    Area and system clock effects on SMT/CMP throughput

  • Author

    Burns, James ; Gaudiot, Jean-Luc

  • Author_Institution
    Intel Corp., USA
  • Volume
    54
  • Issue
    2
  • fYear
    2005
  • Firstpage
    141
  • Lastpage
    152
  • Abstract
    Two approaches to high throughput processors are chip multiprocessing (CMP) and simultaneous multithreading (SMT). CMP increases layout efficiency, which allows more functional units and a faster clock rate. However, CMP suffers from hardware partitioning of functional resources. SMT increases functional unit utilization by issuing instructions simultaneously from multiple threads. However, a wide-issue SMT suffers from layout and technology implementation problems. We use silicon resources as our basis for comparison and find that area and system clock have a large effect on the optimal SMT/CMP design trade. We show the area overhead of SMT on each processor and how it scales with the width of the processor pipeline and the number of SMT threads. The wide issue SMT delivers the highest single-thread performance with improved multithread throughput. However, multiple smaller cores deliver the highest throughput. Also, alternate processor configurations are explored that trade off SMT threads for other microarchitecture features. The result is a small increase to single-thread performance, but a fairly large reduction in throughput.
  • Keywords
    VLSI; clocks; integrated circuit layout; multi-threading; multiprocessing systems; parallel architectures; pipeline processing; system-on-chip; chip multiprocessing processor; hardware partition; layout area estimation; microarchitecture tradeoff; pipeline processor architecture; silicon resources; simultaneous multithreading throughput; system clock rate; Clocks; Delay estimation; Hardware; Microarchitecture; Pipelines; Routing; Silicon; Surface-mount technology; Throughput; Yarn;
  • fLanguage
    English
  • Journal_Title
    Computers, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9340
  • Type

    jour

  • DOI
    10.1109/TC.2005.16
  • Filename
    1377153