DocumentCode
1203145
Title
Hybrid FDTD-MPIE method for the simulation of locally inhomogeneous multilayer LTCC structure
Author
En-Xiao Liu ; Er-Ping Li ; Le-Wei Li
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
Volume
15
Issue
1
fYear
2005
Firstpage
42
Lastpage
44
Abstract
A new hybrid finite-difference time-domain (FDTD) and mixed potential integral equation (MPIE) method is proposed for the modeling of multilayer planar circuits with locally inhomogeneous objects. By using equivalence principle, the original problem can be decomposed into two kinds of regions. The FDTD method is employed to model the locally inhomogeneous objects and construct an interaction matrix to be used in the subsequent model coupling procedure. The MPIE method with less singular kernels is applied to model the layered structure with possible perfect electric conductors. The FDTD model and the MPIE model are coupled together by enforcing the continuity of the tangential electric and magnetic fields on the equivalent surface using a Galerkin testing procedure. Numerical results are presented to validate the proposed hybrid FDTD-MPIE method.
Keywords
Galerkin method; ceramic packaging; circuit simulation; finite difference time-domain analysis; inhomogeneous media; integral equations; integrated circuit modelling; multilayers; Galerkin testing procedure; electric fields; equivalence principle; finite-difference time-domain method; inhomogeneous object; interaction matrix; low temperature co-fired ceramic; magnetic fields; mixed potential integral equation method; multilayer LTCC structure; multilayer planar circuits; Circuit simulation; Conductors; Coupling circuits; Finite difference methods; Integral equations; Kernel; Matrix decomposition; Nonhomogeneous media; Time domain analysis; Transmission line matrix methods; Hybrid finite-difference time-domain (FDTD) and mixed potential integral equation (MPIE) method; inhomogeneous object; low temperature co-fired ceramic (LTCC); multilayer structure;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2004.840981
Filename
1377347
Link To Document