DocumentCode
1204531
Title
Au/Pt/Ti/Ni ohmic contacts to p-ZnTe
Author
Mochizuki, K. ; Terano, Akihisa ; Momose, M. ; Taike, A. ; Kawata, Masakatsu ; Gotoh, J. ; Nakatsuka, Shoko
Author_Institution
Central Res. Lab., Hitachi Ltd., Tokyo
Volume
30
Issue
23
fYear
1994
fDate
11/10/1994 12:00:00 AM
Firstpage
1984
Lastpage
1985
Abstract
Ohmic contacts of Au/Pd/Ti/Ni to p-ZnTe show a minimum specific contact resistance of 10-6 Ωcm2 for a p-type doping level of 3×1019 cm-3 and at an annealing temperature of 300°C. The Ni and Ti layers are very effective in improving the electrical properties of these contact
Keywords
II-VI semiconductors; annealing; contact resistance; gold; nickel; ohmic contacts; platinum; semiconductor-metal boundaries; titanium; zinc compounds; 300 C; Au-Pt-Ti-Ni-ZnTe; annealing temperature; electrical properties; ohmic contacts; p-type doping level; specific contact resistance;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19941326
Filename
335633
Link To Document