DocumentCode
1205006
Title
Alignment-Independent Chip-to-Chip Communication for Sensor Applications Using Passive Capacitive Signaling
Author
Lin, Yu-Shiang ; Sylvester, Dennis ; Blaauw, David
Author_Institution
Univ. of Michigan, Ann Arbor, MI
Volume
44
Issue
4
fYear
2009
fDate
4/1/2009 12:00:00 AM
Firstpage
1156
Lastpage
1166
Abstract
We propose a capacitive coupling based method for sensor data retrieval that can be easily integrated with miniature sensor nodes of sub-mm scale. To enable passive operation of the sensor chip, the data retrieval chip sends power to/receives signal from the sensor chip simultaneously. An alignment detection and pad reconfiguration mechanism is implemented to allow convenient read-out without precise positioning. A test chip was fabricated in 0.13 mum CMOS technology. The silicon measurement results demonstrate <15% difference in achievable data rate can be obtained when the sensor chip is randomly dropped on the data retrieval chip regardless of alignment.
Keywords
CMOS integrated circuits; microsensors; signalling; CMOS technology; alignment-independent chip-to-chip communication; miniature sensor nodes; passive capacitive signaling; sensor applications; sensor data retrieval; Bandwidth; CMOS technology; Capacitive sensors; Energy consumption; Hardware; Information retrieval; Radiofrequency identification; Silicon; Testing; Transponders; Capacitive coupling; proximity communication;
fLanguage
English
Journal_Title
Solid-State Circuits, IEEE Journal of
Publisher
ieee
ISSN
0018-9200
Type
jour
DOI
10.1109/JSSC.2009.2014024
Filename
4804988
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