• DocumentCode
    1205006
  • Title

    Alignment-Independent Chip-to-Chip Communication for Sensor Applications Using Passive Capacitive Signaling

  • Author

    Lin, Yu-Shiang ; Sylvester, Dennis ; Blaauw, David

  • Author_Institution
    Univ. of Michigan, Ann Arbor, MI
  • Volume
    44
  • Issue
    4
  • fYear
    2009
  • fDate
    4/1/2009 12:00:00 AM
  • Firstpage
    1156
  • Lastpage
    1166
  • Abstract
    We propose a capacitive coupling based method for sensor data retrieval that can be easily integrated with miniature sensor nodes of sub-mm scale. To enable passive operation of the sensor chip, the data retrieval chip sends power to/receives signal from the sensor chip simultaneously. An alignment detection and pad reconfiguration mechanism is implemented to allow convenient read-out without precise positioning. A test chip was fabricated in 0.13 mum CMOS technology. The silicon measurement results demonstrate <15% difference in achievable data rate can be obtained when the sensor chip is randomly dropped on the data retrieval chip regardless of alignment.
  • Keywords
    CMOS integrated circuits; microsensors; signalling; CMOS technology; alignment-independent chip-to-chip communication; miniature sensor nodes; passive capacitive signaling; sensor applications; sensor data retrieval; Bandwidth; CMOS technology; Capacitive sensors; Energy consumption; Hardware; Information retrieval; Radiofrequency identification; Silicon; Testing; Transponders; Capacitive coupling; proximity communication;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.2009.2014024
  • Filename
    4804988