DocumentCode :
1205006
Title :
Alignment-Independent Chip-to-Chip Communication for Sensor Applications Using Passive Capacitive Signaling
Author :
Lin, Yu-Shiang ; Sylvester, Dennis ; Blaauw, David
Author_Institution :
Univ. of Michigan, Ann Arbor, MI
Volume :
44
Issue :
4
fYear :
2009
fDate :
4/1/2009 12:00:00 AM
Firstpage :
1156
Lastpage :
1166
Abstract :
We propose a capacitive coupling based method for sensor data retrieval that can be easily integrated with miniature sensor nodes of sub-mm scale. To enable passive operation of the sensor chip, the data retrieval chip sends power to/receives signal from the sensor chip simultaneously. An alignment detection and pad reconfiguration mechanism is implemented to allow convenient read-out without precise positioning. A test chip was fabricated in 0.13 mum CMOS technology. The silicon measurement results demonstrate <15% difference in achievable data rate can be obtained when the sensor chip is randomly dropped on the data retrieval chip regardless of alignment.
Keywords :
CMOS integrated circuits; microsensors; signalling; CMOS technology; alignment-independent chip-to-chip communication; miniature sensor nodes; passive capacitive signaling; sensor applications; sensor data retrieval; Bandwidth; CMOS technology; Capacitive sensors; Energy consumption; Hardware; Information retrieval; Radiofrequency identification; Silicon; Testing; Transponders; Capacitive coupling; proximity communication;
fLanguage :
English
Journal_Title :
Solid-State Circuits, IEEE Journal of
Publisher :
ieee
ISSN :
0018-9200
Type :
jour
DOI :
10.1109/JSSC.2009.2014024
Filename :
4804988
Link To Document :
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