Title :
Applications of polyimide films to the electrical and electronic industries in Japan
Author :
Sugimoto, Eiichi
Author_Institution :
Nitto Denko Corp., Tokyo, Japan
Abstract :
The development of polyimide films in Japan is discussed. The chemical structure of the films and their polymerization mechanisms are described. Types of polyimide films are identified, and their characteristics are examined. Special attention is given to their thermal and chemical properties and their radiation resistance. Applications of polyimide films to rotating machines, integrated circuits, tape-automated bonding, flexible printed-circuit boards, electric wires, aerospace and nuclear equipment, and recording devices are discussed.<>
Keywords :
organic insulating materials; polymer films; Japan; aerospace; chemical properties; chemical structure; electric wires; flexible printed-circuit boards; integrated circuits; nuclear equipment; organic insulating material; polyimide films; polymerization mechanisms; radiation resistance; recording devices; rotating machines; tape-automated bonding; thermal properties; Application specific integrated circuits; Bonding; Chemicals; Electric resistance; Electronics industry; Polyimides; Polymer films; Rotating machines; Thermal resistance; Wires;
Journal_Title :
Electrical Insulation Magazine, IEEE
