DocumentCode :
1205395
Title :
Development of a high strength, high conductivity copper-silver alloy for pulsed magnets
Author :
Sakai, Y. ; Inoue, K. ; Asano, T. ; Maeda, H.
Author_Institution :
Nat. Res. Inst. for Metals, Ibaraki, Japan
Volume :
28
Issue :
1
fYear :
1992
fDate :
1/1/1992 12:00:00 AM
Firstpage :
888
Lastpage :
891
Abstract :
The development of highly conductive materials with high strength is requisite for conductors of high-field magnets. To develop such materials, Cu-Ag alloys (2-60 at.%) and their fabrication methods have been investigated. The Cu-Ag alloys were prepared by melting electrolytic Cu and pure Ag pellets in an argon atmosphere, and then cold-drawn to a 99.2% reduction in area. The heat treatments were performed several times during the drawing process. The strength and conductivity of the Cu-Ag alloys vary with thermomechanical treatments. The optimum combination of high strength and high electrical conductivity was obtained by cold-drawing the alloy with intermediate heat treatments at 350-450°C for 1-2 h. The intermediate-heat-treated Cu-16 at.% Ag composite with 99% reduction in area had an ultimate tensile strength of 1000 MPa and an electrical conductivity of 80 IACS.% at room temperature
Keywords :
copper alloys; drawing (mechanical); electrical conductivity of crystalline metals and alloys; electromagnets; materials preparation; silver alloys; tensile strength; thermomechanical treatment; 1 to 2 h; 350 to 450 degC; Cu-Ag alloys; cold-drawing; drawing; electrical conductivity; fabrication methods; heat treatments; high-field magnets; highly conductive materials; intermediate heat treatments; pulsed magnets; thermomechanical treatments; ultimate tensile strength; Argon; Atmosphere; Conducting materials; Conductivity; Copper alloys; Fabrication; Heat treatment; Magnetic materials; Magnets; Thermomechanical processes;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.120021
Filename :
120021
Link To Document :
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