Title :
A compact planar inverted-F antenna with a PBG-type ground plane for mobile communications
Author :
Du, Zhengwei ; Gong, Ke ; Fu, Jeffrey S. ; Gao, Baoxin ; Feng, Zhenghe
Author_Institution :
Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
fDate :
5/1/2003 12:00:00 AM
Abstract :
The ground plane affects the characteristics of a planar inverted-F antenna (PIFA) significantly. Using the idea of the high-impedance surface to construct the ground plane, a new type of compact PIFA with a photonic bandgap type (PBG-type) ground plane is proposed. Both the traditional PIFA and the proposed antenna are analyzed using the finite-difference time-domain (FDTD) method in detail. It is found that the two antennas have similar directivity pattern characteristics, but the size of the latter can be reduced obviously. The results also show that the bandwidth of a traditional PIFA is not greatly affected by the thickness of the metallic ground plane and that the shapes of the directivity patterns are not greatly affected by the ground plane under the small size condition. The operating-frequency band of the proposed antenna can be adjusted by changing the dielectric substrate thickness of the ground plane. They are suitable for mobile communication applications.
Keywords :
antenna earths; antenna radiation patterns; electric impedance; finite difference time-domain analysis; mobile antennas; mobile radio; photonic band gap; planar antenna arrays; FDTD; PBG-type ground plane; antenna directivity pattern; bandwidth; compact PIFA; compact planar inverted-F antenna; dielectric substrate thickness; finite-difference time-domain method; high-impedance surface; metallic ground plane thickness; mobile antennas; mobile communications; operating-frequency band; photonic bandgap type ground plane; planar inverted-F antenna; small size condition; Associate members; Bandwidth; Finite difference methods; Loaded antennas; Mobile antennas; Mobile communication; Photonic band gap; Surface impedance; Surface waves; Time domain analysis;
Journal_Title :
Vehicular Technology, IEEE Transactions on
DOI :
10.1109/TVT.2003.811526