DocumentCode
1206665
Title
Equivalent circuit model of on-wafer CMOS interconnects for RFICs
Author
Shi, Xiaomeng ; Ma, Jian-Guo ; Yeo, Kiat Seng ; Do, Manh Anh ; Li, Erping
Author_Institution
Center for Integrated Circuits & Syst., Nanyang Technol. Univ., Singapore
Volume
13
Issue
9
fYear
2005
Firstpage
1060
Lastpage
1071
Abstract
This paper investigates the properties of the on-wafer interconnects built in a 0.18-/spl mu/m CMOS technology for RF applications. A scalable equivalent circuit model is developed. The model parameters are extracted directly from the on-wafer measurements and formulated into empirical expressions. The expressions are in functions of the length and the width of the interconnects. The proposed model can be easily implemented into commercial RF circuit simulators. It provides a novel solution to include the frequency-variant characteristics into a circuit simulation. The silicon-verified accuracy is proved to be up to 25 GHz with an average error less than 2%. Additionally, equivalent circuit model for longer wires can be obtained by cascading smaller subsections together. The scalability of the propose model is demonstrated.
Keywords
CMOS integrated circuits; S-parameters; circuit simulation; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; radiofrequency integrated circuits; 0.18 micron; RF CMOS interconnects; RFIC; circuit simulation; lumped equivalent circuit model; on-wafer measurements; scattering parameters measurement; skin effect; substrate losses; CMOS technology; Circuit simulation; Consumer electronics; Design automation; Equivalent circuits; Integrated circuit interconnections; Integrated circuit technology; Radio frequency; Radiofrequency integrated circuits; Semiconductor device modeling; Empirical formulas; RF CMOS interconnects; lumped equivalent circuit model; modeling; scalable; scattering parameters measurement; skin effect; substrate losses;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2005.857177
Filename
1525038
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