• DocumentCode
    1206913
  • Title

    An Analysis of the NBTI-Induced Threshold Voltage Shift Evaluated by Different Techniques

  • Author

    Ji, Zhigang ; Zhang, Jian Fu ; Chang, Mo Huai ; Kaczer, Ben ; Groeseneken, Guido

  • Author_Institution
    Sch. of Eng., Liverpool John Moores Univ., Liverpool
  • Volume
    56
  • Issue
    5
  • fYear
    2009
  • fDate
    5/1/2009 12:00:00 AM
  • Firstpage
    1086
  • Lastpage
    1093
  • Abstract
    Negative bias temperature instability (NBTI) is limiting the lifetime of pMOSFETs, and it is often monitored by the shift of threshold voltage DeltaVt. Different techniques have been developed to extract DeltaVt, including the conventional extrapolation of the quasi-dc transfer characteristic I d ~V g and the more recent extrapolation of ultrafast pulse I d ~V g and the on-the-fly evaluation at stress bias. After the same stress, these techniques can produce a DeltaVt difference of up to one order of magnitude. The interpretation of this large difference is still controversial. The objective of this paper is to bridge the gap between the DeltaVt values extracted from these techniques. Degradation and recovery during measurement, measurement and truncation errors, and calculation of transconductance are all examined. After taking these factors into account, the gap in DeltaVt still cannot be filled, and hence, the effect of sensing Vg on DeltaVt must now be considered. It is found that | DeltaVt | increases with sensing | Vg |, and therefore, the popular assumption of DeltaVt being independent of sensing Vg is invalid. After taking both the effect of sensing Vg and recovery into account, the gap in |DeltaVt| is successfully bridged. The difference between the effect of sensing Vg and recovery is explored, and the results show that they are two different phenomena. This paper provides test engineers a method for determining the worst case DeltaVt under a given operation voltage.
  • Keywords
    CMOS integrated circuits; MOSFET; electrical conductivity; extrapolation; semiconductor device measurement; semiconductor device testing; CMOS technology; degradation; device lifetime; extrapolation technique; negative bias temperature instability; pMOSFETs; threshold voltage shift; transconductance; Bridge circuits; Degradation; Extrapolation; MOSFETs; Monitoring; Negative bias temperature instability; Niobium compounds; Stress; Threshold voltage; Titanium compounds; Bias temperature instability; degradation; device lifetime; negative bias temperature instability (NBTI); on-the-fly (OTF); threshold voltage shift;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2009.2016400
  • Filename
    4806063