Prevention of Boundary Image Sticking in an AC Plasma Display Panel Using a Vacuum Sealing Process

Author

Park, Choon-Sang ; Tae, Heung-Sik ; Kwon, Young-Kuk ; Heo, Eun Gi ; Lee, Byung-Hak

Author_Institution

Sch. of Electr. Eng. & Comput. Sci., Kyungpook Nat. Univ., Daegu

Volume

55

Issue

6

fYear

2008

fDate

6/1/2008 12:00:00 AM

Firstpage

1345

Lastpage

1351

Abstract

Boundary image sticking can be inherently prevented in an ac plasma display panel fabricated using a vacuum sealing process. The results indicate that residual impurities, such as nitrogen or oxygen, are essentially related to the production of boundary image sticking. When checking the production of boundary image sticking in a test panel fabricated using a or an flow during the vacuum sealing process, no boundary image sticking appeared in the case of a flow, whereas boundary image sticking was produced with an flow, although the test panel was fabricated using a vacuum sealing process. Consequently, reducing the residual impurity, particularly oxygen, based on a vacuum sealing process can inherently prevent boundary image sticking.

Keywords

plasma displays; ac plasma display panel; boundary image sticking; particularly oxygen; test panel fabricated; vacuum sealing process; Focusing; Impurities; Ion beams; Nitrogen; Plasma displays; Production; Scanning electron microscopy; Sputtering; Testing; Transportation; $hbox{O}_{2}$ or $hbox{N}_{2}$ flow; 42-in ac plasma display panel (ac-PDP) module; $hbox{O}_{2}$ or $hbox{N}_{2}$ flow; Atmospheric pressure sealing process; MgO hardness; MgO sputtering rate; boundary image sticking; focused ion beam (FIB); impurity gas; nanoindentor; scanning electron microscope (SEM); time-of-flight secondary ion mass spectrometry (TOF-SIMS); vacuum sealing process;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/TED.2008.921986

Filename

4505439