DocumentCode :
1207583
Title :
Minority-carrier hole diffusion length in heavily-doped polysilicon and its influence on polysilicon-emitter transistors
Author :
Chen, Dao-Long ; Greve, David W. ; Guzman, Alberto M.
Author_Institution :
Carnegie-Mellon Univ., Pittsburgh, PA, USA
Volume :
35
Issue :
7
fYear :
1988
fDate :
7/1/1988 12:00:00 AM
Firstpage :
1045
Lastpage :
1054
Abstract :
The minority-carrier hole diffusion lengths in heavily doped polysilicon with and without hydrogen passivation were determined by analyzing the photon-induced current in polysilicon-emitter diode structure. After hydrogen passivation, the minority-carrier hole diffusion length in polysilicon was increased by a factor of approximately 3.5. Such an increase in diffusion length should result in an increase in polysilicon-emitter transistor current gain if the transport model of T.H. Ning and R.D. Issac (1980) is valid. However, by comparing transistors with and without hydrogen passivation, it is found that the polysilicon-monosilicon interface properties are more important than the minority-carrier transport properties in the polysilicon layer in determining the current gain for transistors with emitter doping >1×1020 cm-3. Nevertheless, for an emitter doping ⩽1×1020 cm-3, the diffusion and recombination inside the polysilicon layer has to be taken into account
Keywords :
bipolar integrated circuits; bipolar transistors; diffusion in solids; electron-hole recombination; elemental semiconductors; heavily doped semiconductors; interface phenomena; minority carriers; passivation; semiconductor device models; silicon; H passivation; Si; bipolar transistors; current gain; elemental semiconductors; heavily-doped polysilicon; hole diffusion length; interface properties; minority-carrier; numerical model; photon-induced current; polycrystalline Si; polysilicon-emitter transistors; recombination; transport properties; Bipolar integrated circuits; Doping; Hydrogen; Passivation; Radiative recombination; Read-write memory; Semiconductor diodes; Semiconductor process modeling; Silicon; Transistors;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.3363
Filename :
3363
Link To Document :
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