DocumentCode
1207838
Title
Applications ´90: industrial electronics
Author
Kaplan, G.
Author_Institution
IEEE Spectrum, New York, NY, USA
Volume
27
Issue
2
fYear
1990
Firstpage
42
Lastpage
43
Abstract
Advances in industrial electronics during 1989 are described. These include: the use of X-ray scanning-beam laminography to check solder joints on printed-circuit boards; pressure microsensors based on changing resonance frequency by applied force; emergence of the service industry as a market for robots; a computerized facility that allows rapid acquisitions of manufactured parts; and increased use of modular integrated power functions in power electronics systems.<>
Keywords
electric sensing devices; manufacturing data processing; printed circuit testing; robots; AD 1989; X-ray scanning-beam laminography; industrial electronics; manufactured part acquisition computer facility; modular integrated power functions; power electronics systems; pressure microsensors; printed-circuit boards; service industry robots; solder joint checking; Application software; Computer aided manufacturing; Computer industry; Electronics industry; Industrial electronics; Manufacturing industries; Microsensors; Resonance; Resonant frequency; Soldering;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/6.45078
Filename
45078
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