DocumentCode :
1208114
Title :
A room temperature 0.1 μm CMOS on SOI
Author :
Shahidi, Ghavam G. ; Anderson, Carl A. ; Chappell, Barbara A. ; Chappell, Terry I. ; Comfort, James H. ; Davari, Bijan ; Dennard, Robert H. ; Franch, Robert L. ; McFarland, Patricia A. ; Neely, James S. ; Ning, Tak H. ; Polcari, Michael R. ; Warnock, Jame
Author_Institution :
Semicond. Res. & Dev. Center, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume :
41
Issue :
12
fYear :
1994
fDate :
12/1/1994 12:00:00 AM
Firstpage :
2405
Lastpage :
2412
Abstract :
An advanced 0.1 μm CMOS technology on SOI is presented. In order to minimize short channel effects, relatively thick nondepleted (0.15 μm) SOI film, highly nonuniform channel doping and source-drain extension-halo were used. Excellent short channel effects (SCE) down to channel lengths below 0.1 μm were obtained. It is shown that undepleted SOI results in better short channel effect when compared to ultrathin depleted SOI. Devices with little short channel effect all the way to below 500 Å effective channel length were obtained. Furthermore, utilization of source-drain extension-halo minimizes the bipolar effect inherent in the floating body. These devices were applied to a variety of circuits: Very high speeds were obtained: Unloaded delay was 20 ps, unloaded NAND (FI=FO=3) was 64 ps, and loaded NAND (FI=FO=3, CL=0.3 pF) delay was 130 ps at supply of 1.8 V. This technology was applied to a self-resetting 512 K SRAM. Access times of 2.5 ns at 1.5 V and 3.5 ns at 1.0 V were obtained
Keywords :
CMOS integrated circuits; CMOS memory circuits; SRAM chips; integrated circuit technology; silicon-on-insulator; 0.1 micron; 1 to 1.8 V; 2.5 to 3.5 ns; 20 to 130 ps; 512 Kbit; CMOS on SOI; Si; floating body; highly nonuniform channel doping; nondepleted SOI film; room temperature operation; self-resetting SRAM; short channel effects; source-drain extension-halo; undepleted SOI; CMOS technology; Circuits; Delay; Doping; Electric breakdown; MOS devices; Random access memory; System performance; Temperature; Ultra large scale integration;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.337456
Filename :
337456
Link To Document :
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