• DocumentCode
    1208383
  • Title

    Assembly of laser-fiber arrays

  • Author

    Hall, Shawn A. ; Lane, Ramon ; Wang, Han-chung ; Gareri, Aldo

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    12
  • Issue
    10
  • fYear
    1994
  • fDate
    10/1/1994 12:00:00 AM
  • Firstpage
    1820
  • Lastpage
    1826
  • Abstract
    This paper describes techniques and machinery for first-level packaging of laser-to-fiber interconnects using batch assembly and active alignment. These techniques are economical because the costs of labor-intensive processes, such as parts handling, fiber-polishing, and alignment, are shared among the many elements of the array. Using these techniques, prototype packages have been built consisting of 32-wide arrays of 1300 nm lasers coupled to 32-wide arrays of single-mode fiber-optic stubs. Building the package involves three steps: (1) preparing the laser array for handling and alignment by soldering it to a metallized silicon carrier; (2) building the fiber array by stripping the fibers, placing them precisely into etched silicon V-grooves, bonding them in place, and polishing both ends; and (3) aligning the two arrays to each other using batch, active alignment. Batch alignment succeeds to the extent that each array is collinear, so the collinearity achieved in processes (1) and (2) is crucial. Typically, collinearity of ±1 μm or better is achieved for each array. When such arrays are batch aligned using the techniques described herein, the average coupling efficiency is about 88% as large as it would be if each laser-fiber pair were optimally aligned individually
  • Keywords
    optical couplers; optical fibre fabrication; optical fibres; optical interconnections; packaging; polishing; semiconductor lasers; soldering; 1300 nm; 1300 nm lasers; 32-wide arrays; 88 percent; active alignment; average coupling efficiency; batch assembly; bonding; collinear; economical; etched silicon V-grooves; fiber stripping; fiber-polishing; first-level packaging; labor-intensive processes; laser diode coupling; laser-fiber array assembly; laser-to-fiber interconnects; metallized silicon carrier; parts handling; polishing; prototype packages; single-mode fiber-optic stubs; soldering; Assembly; Costs; Fiber lasers; Machinery; Optical arrays; Optical coupling; Packaging machines; Prototypes; Silicon; Soldering;
  • fLanguage
    English
  • Journal_Title
    Lightwave Technology, Journal of
  • Publisher
    ieee
  • ISSN
    0733-8724
  • Type

    jour

  • DOI
    10.1109/50.337495
  • Filename
    337495