DocumentCode :
1208540
Title :
Accurate System Voltage and Timing Margin Simulation in High-Speed I/O System Designs
Author :
Kyung Suk Oh ; Lambrecht, F. ; Sam Chang ; Qi Lin ; Jihong Ren ; Chuck Yuan ; Zerbe, J. ; Stojanovic, V.
Author_Institution :
Rambus, Inc., Los Altos, CA
Volume :
31
Issue :
4
fYear :
2008
Firstpage :
722
Lastpage :
730
Abstract :
Accurate analysis of system timing and voltage margin including deterministic and random jitter is crucial in high-speed I/O system designs. Traditional SPICE-based simulation techniques can precisely simulate various deterministic jitter sources, such as intersymbol interference (ISI) and crosstalk from passive channels. The inclusion of random jitter in SPICE simulations, however, results in long simulation time. Innovative simulation techniques based on a statistical simulation framework have been recently introduced to cosimulate deterministic and random jitter effects efficiently. This paper presents new improvements on this statistical simulation framework. In particular, we introduce an accurate jitter modeling technique which accounts for bounded jitter with arbitrary spectrum in addition to Gaussian jitter. We also present a rigorous approach to model duty cycle distortion (DCD). A number of I/O systems are considered as examples to validate the proposed modeling methodology.
Keywords :
SPICE; crosstalk; intersymbol interference; jitter; statistical analysis; Gaussian jitter; SPICE simulations; arbitrary spectrum; deterministic jitter; duty cycle distortion; high-speed I/O system; innovative simulation techniques; intersymbol interference; passive channels; random jitter; statistical simulation framework; system voltage; timing margin simulation; Analytical models; Bit error rate; Crosstalk; Intersymbol interference; Jitter; Sampling methods; System analysis and design; Timing; Transmitters; Voltage; Bit error rate (BER) simulation; high-speed link; jitter modeling; random jitter; statistical analysis; statistical eye; system margin simulation;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2008.923388
Filename :
4509472
Link To Document :
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