• DocumentCode
    1210474
  • Title

    A time-domain surface integral technique for mixed electromagnetic and circuit simulation

  • Author

    Yang, Chuanyi ; Jandhyala, Vikram

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
  • Volume
    28
  • Issue
    4
  • fYear
    2005
  • Firstpage
    745
  • Lastpage
    753
  • Abstract
    This paper presents a coupled simulation approach in the time domain for modeling nonlinear circuits, electromagnetic components, and electromagnetic interference (EMI) interactions together in one integrated methodology. The approach is based on a rigorous coupling of circuit simulation and time-domain integral equation simulation. The method obviates the need for circuit realizations of electromagnetic interactions, and can be considered complementary to the partial element equivalent circuits, for cases where surface-based modeling is preferable such as complex connectors and packages, and for Green´s function based modeling of skin effects.
  • Keywords
    Green´s function methods; circuit simulation; electromagnetic interference; equivalent circuits; integrated circuit packaging; skin effect; time-domain analysis; Green function; circuit simulation; electromagnetic interactions; electromagnetic interference; time-domain surface integral technique; Circuit simulation; Connectors; Coupling circuits; Electromagnetic coupling; Electromagnetic interference; Electromagnetic modeling; Equivalent circuits; Integral equations; Nonlinear circuits; Time domain analysis; Coupled circuit-electromagnetic (EM) simulation; electromagnetic interference (EMI); modified nodal analysis; surface impedance; time-domain integral equation (TDIE);
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2005.848389
  • Filename
    1528660