• DocumentCode
    1210525
  • Title

    Anomalous narrow channel effect in trench-isolated buried-channel p-MOSFET´s

  • Author

    Mandelman, J.A. ; Alsmeier, J.

  • Author_Institution
    IBM Microelectron. Div., IBM Semicond. Res. & Dev. Centre, Hopewell Junction, NY, USA
  • Volume
    15
  • Issue
    12
  • fYear
    1994
  • Firstpage
    496
  • Lastpage
    498
  • Abstract
    An anomalous threshold voltage dependence on channel width measured on 0.25 μm groundrule trench-isolated buried-channel p-MOSFET\´s is reported here. As the channel width is reduced, the magnitude of the threshold voltage first decreases before the onset of the expected sharp rise in Vt for widths narrower than 0.4 μm. Modeling shows that a "boron puddle" is created near the trench bounded edge as a result of transient enhanced diffusion (TED) during the gate oxidation step. TED is governed by interstitials produced by a deep phosphorus implant, used for latchup suppression, diffusing towards the trench sidewall and top surface of the device. The presence of the "boron puddle" imposes a penalty on the off-current of narrow devices. A solution for minimizing the "boron puddle" is demonstrated with simulations, confirmed by measurements.
  • Keywords
    MOSFET; buried layers; diffusion; interstitials; isolation technology; 0.25 to 0.4 micron; Si:B,P; boron puddle; deep phosphorus implant; gate oxidation; groundrule trench-isolated buried-channel p-MOSFETs; interstitials; latchup suppression; narrow channel; off-current; simulations; threshold voltage; transient enhanced diffusion; Boron; CMOS process; Doping; Implants; Low voltage; MOSFET circuits; Oxidation; Silicon; Threshold voltage; Ultra large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.338415
  • Filename
    338415