• DocumentCode
    1211241
  • Title

    A new full-wave hybrid differential-integral approach for the investigation of multilayer structures including nonuniformly doped diffusions

  • Author

    Wane, Sidina ; Bajon, Damienne ; Baudrand, Henri ; Gamand, Patrice

  • Author_Institution
    Ecole Nat. Superieure de l´´Electronique, Toulouse, France
  • Volume
    53
  • Issue
    1
  • fYear
    2005
  • Firstpage
    200
  • Lastpage
    214
  • Abstract
    A novel hybrid differential-integral approach, based on the transverse wave formulation (TWF) is presented for full-wave investigation of multilayer structures including inhomogeneous layer stacks with arbitrary doping profiles. In combining both the benefits of spatial and spectral resolutions, the TWF offers a natural framework for the implementation of multiresolution and multiscale approaches from physical considerations. The possibility of separating the transverse TE and TM components of the TWF solution is discussed. Original isolation structures based on the oxide deep-trenches technique are proposed and demonstrate significant isolation capability in the context of RF integrated-circuit applications.
  • Keywords
    BiCMOS integrated circuits; doping profiles; integrated circuit modelling; integro-differential equations; isolation technology; multilayers; radiofrequency integrated circuits; RF integrated circuit; arbitrary doping profiles; deep-trenches technique; full wave hybrid differential-integral approach; inhomogeneous layer; isolation structures; multilayer structure; nonuniformly doped diffusion; spatial resolution; spectral resolution; transverse TE components; transverse TM components; transverse wave formulation; Coupling circuits; Dielectric substrates; Doping profiles; Integral equations; Noise reduction; Nonhomogeneous media; Radio frequency; Radiofrequency integrated circuits; Semiconductor device noise; Spatial resolution;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2004.839905
  • Filename
    1381690