Title :
Demountable TAB-a new path for TAB technology
Author :
Pendse, Rajendra D. ; Afshari, Bahram ; Heflinger, Bruce ; Matta, Farid ; Rastogi, Vivek
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
fDate :
11/1/1994 12:00:00 AM
Abstract :
Despite its advantages, the proliferation of TAB technology in the high lead count single chip packaging world has been somewhat limited by factors such as high entry cost and complex board-level assembly methods. In the area of MCM´s, the difficulty of rework/repair of TAB emerges as a serious limiter. The TAB package developed at Hewlett-Packard addresses these very issues by providing bumpless inner lead bonding and demountable outer lead connection (hence called Demountable TAB, or DTAB). In the present paper, a comprehensive compilation of the DTAB packaging scheme is presented. The package construction, assembly procedure, PC board design considerations, thermal performance, electrical characterization and reliability testing are presented in detail
Keywords :
integrated circuit packaging; integrated circuit reliability; lead bonding; multichip modules; printed circuit design; tape automated bonding; DTAB packaging scheme; MCMs; PC board design considerations; TAB technology; assembly procedure; bumpless inner lead bonding; demountable TAB; demountable outer lead connection; electrical characterization; lead count; package construction; reliability testing; repair; rework; single chip packaging; thermal performance; Application software; Assembly; Bonding; Costs; Electronic packaging thermal management; Electronics packaging; Lead; Manufacturing; Testing; Wire;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
