TBGA package technology

Author

Andros, Frank E. ; Hammer, Richard B.

Author_Institution

IBM Corp., Endicott, NY, USA

Volume

17

Issue

4

fYear

1994

fDate

11/1/1994 12:00:00 AM

Firstpage

564

Lastpage

568

Abstract

TBGA or Tape Ball Grid Array is a ball grid array package which utilizes solder bumps to connect the TAB tape to the printed circuit card or board. The array of outer lead bond (OLB) joints is typically on a 50 mil grid. This technology differs from conventional TAB peripheral OLB in that the package can be “picked and placed” using conventional card assembly equipment and processes at very high assembly yields. If thermal enhancement is required, a heatsink can be attached to the die. The technology can be applied to both single and double level metal tape; and can utilize various inner lead bonding (ILB) techniques, i.e., peripheral thermocompression, thermosonic, or wirebonding, and area array solder reflow. This paper describes the package technology, applications, and attributes

Keywords

integrated circuit packaging; lead bonding; printed circuit manufacture; soldering; tape automated bonding; ILB techniques; OLB joints; PCB assembly; TBGA package technology; area array solder reflow; conventional card assembly equipment; double level metal tape; heatsink; inner lead bonding; outer lead bond joints; peripheral thermocompression bonding; pick/place operation; printed circuit board; printed circuit card; single level metal tape; solder bumps; tape ball grid array; thermosonic bonding; wirebonding; Assembly; Bonding; Consumer products; Costs; Electronics packaging; Lead; Packaging machines; Portable computers; Printed circuits; Surface-mount technology;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.338724

Filename

338724