Application of lead-free eutectic Sn-Ag solder in no-clean thick film electronic modules

Author

Shangguan, Dongkai ; Achari, Achyuta ; Green, Wells

Author_Institution

Electron. Div., Ford Motor Co., Dearborn, MI, USA

Volume

17

Issue

4

fYear

1994

fDate

11/1/1994 12:00:00 AM

Firstpage

603

Lastpage

611

Abstract

As part of the lead-free solder development process currently underway, this paper presents the evaluation of the lead-free Sn-Ag solder for use in no-clean thick film electronics packages. The Sn-Ag (96.5/3.5 wt%) eutectic solder alloy, with a no clean flux system, is the focus of this study. Based on studies of metallurgical interactions, the conductor/substrate adhesion, and electromigration/dendritic growth, it is concluded that this solder has superior overall properties and is suitable for solder interconnects in thick film automotive electronics packages when used with a mixed bonded Ag conductor

Keywords

adhesion; electromigration; integrated circuit packaging; microassembling; modules; silver alloys; soldering; thick film circuits; tin alloys; Pb-free solder development process; Sn-Ag; conductor/substrate adhesion; dendritic growth; electromigration; eutectic Sn-Ag solder; mixed bonded Ag conductor; no clean flux system; no-clean thick film electronic modules; solder interconnects; thick film automotive electronics packages; Adhesives; Automotive electronics; Bonding; Conductive films; Electromigration; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Substrates; Thick films;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.338730

Filename

338730