Characterization of polyimides used in high density interconnects

Author

Pecht, Michael ; Wu, Xin

Author_Institution

CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA

Volume

17

Issue

4

fYear

1994

fDate

11/1/1994 12:00:00 AM

Firstpage

632

Lastpage

639

Abstract

Each of the three different polyimide films used in General Electric and Texas Instrument high-density interconnects has been characterized in terms of its out-of-plane and in-plane coefficient of thermal expansion, glass transition temperature, storage modulus, loss factor, and stress-strain and creep behavior, as a function of temperature and, as appropriate, deformation rate. This paper discusses these factors and the failure mechanisms of Kapton and ULTEM films in tensile tests

Keywords

creep; failure analysis; glass transition; integrated circuit interconnections; integrated circuit packaging; multichip modules; plastic packaging; polymer films; thermal expansion; Kapton films; MCMs; ULTEM films; coefficient of thermal expansion; creep behavior; deformation rate; failure mechanisms; glass transition temperature; high density interconnects; in-plane CTE; loss factor; out-of-plane CTE; polyimides; storage modulus; stress-strain behavior; tensile tests; Creep; Failure analysis; Glass; Instruments; Polyimides; Temperature; Testing; Thermal expansion; Thermal factors; Thermal stresses;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.338734

Filename

338734