DocumentCode
1211730
Title
A Due-Date-Based Algorithm for Lot-Order Assignment in a Semiconductor Wafer Fabrication Facility
Author
Kim, Yeong-Dae ; Bang, June-Young ; An, Kwee-Yeon ; Lim, Seung-Kil
Author_Institution
Dept. of Ind. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon
Volume
21
Issue
2
fYear
2008
fDate
5/1/2008 12:00:00 AM
Firstpage
209
Lastpage
216
Abstract
This paper focuses on a lot-order assignment problem, called the pegging problem, in a semiconductor wafer fabrication facility. Pegging is a process of assigning wafer lots to orders for wafers. We consider two types of pegging strategies: hard pegging strategy, under which the lot-order assignment is not changed once lots are assigned to orders; and soft pegging strategy, under which the lot-order assignment can be changed during the production period. For the soft pegging strategy, we develop three operational policies and three algorithms for the pegging problem of assigning lots to orders with the objective of minimizing total tardiness of the orders. To evaluate performance of the suggested policies and algorithms, we perform simulation experiments using real factory data as well as randomly generated data sets. Results of the simulation tests show that the repegging policies and the algorithms operated under the soft pegging strategy give better results than the hard pegging strategy.
Keywords
semiconductor device manufacture; due-date-based algorithm; hard pegging strategy comparison; lot-order assignment problem; operational policies; pegging problem; production period; randomly generated data sets; real factory data; semiconductor wafer fabrication facility; soft pegging strategy; wafer lots assigning process; Assembly; Companies; Fabrication; Job shop scheduling; Manufacturing processes; Performance evaluation; Production facilities; Semiconductor device manufacture; Semiconductor device testing; Semiconductor materials; Lot-order assignment; scheduling; semiconductor wafer fab;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2008.2000261
Filename
4512064
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