DocumentCode :
1211750
Title :
A Petri Net Method for Schedulability and Scheduling Problems in Single-Arm Cluster Tools With Wafer Residency Time Constraints
Author :
Wu, NaiQi ; Chu, Chengbin ; Chu, Feng ; Zhou, Meng Chu
Volume :
21
Issue :
2
fYear :
2008
fDate :
5/1/2008 12:00:00 AM
Firstpage :
224
Lastpage :
237
Abstract :
With wafer residency time constraints for some wafer fabrication processes, such as low pressure chemical-vapor deposition, the schedulability and scheduling problems are still open. This paper aims to solve both problems. A Petri net (PN) model is developed for the system. This model describes when the robot should wait and a robot wait is modeled as an event in an explicit way. Thus, to schedule a single-arm cluster tool with wafer residency time constraint is to decide how long a robot wait should be. Based on this model, for the first time, we present the necessary and sufficient conditions under which a single-arm cluster tool with residency time constraints is schedulable, which can be checked analytically. Meanwhile, a closed form scheduling algorithm is developed to find an optimal periodic schedule if it is schedulable. Also, a simple method is presented for the implementation of the periodic schedule for steady state, which is not seen in any previous work.
Keywords :
Petri nets; chemical vapour deposition; industrial manipulators; integrated circuit manufacture; process control; scheduling; Petri net method; low pressure chemical-vapor deposition; scheduling; single-arm cluster tools; wafer fabrication processes; wafer handling robot; wafer residency time constraints; Chemical processes; Fabrication; Job shop scheduling; Manufacturing processes; Robots; Semiconductor device manufacture; Semiconductor device modeling; Steady-state; Sufficient conditions; Time factors; Automated manufacturing system; Petri nets (PN); cluster tool; schedulability; scheduling; semiconductor manufacturing;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2008.2000425
Filename :
4512066
Link To Document :
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