• DocumentCode
    1211781
  • Title

    A Process for Inline Minority Carrier Lifetime Monitoring for the Furnace Performing Denuded Zone Formation

  • Author

    Wu, Yung-Hsien ; Wang, Chun-Yao ; Chang, Chih-Ming ; Kuo, Chia-Ming ; Ku, Alex

  • Author_Institution
    Dept. of Eng. & Syst. Sci., Nat. Tsing-Hua Univ., Hsinchu
  • Volume
    21
  • Issue
    2
  • fYear
    2008
  • fDate
    5/1/2008 12:00:00 AM
  • Firstpage
    248
  • Lastpage
    255
  • Abstract
    The fluctuation in the minority carrier lifetime (MCLT) measurement is observed when monitoring the metal contamination for the furnace performing denuded zone formation, and the mechanism responsible for this phenomenon is examined in this paper. Among various possible causes, the oxygen precipitates are found to be the main contributor for this MCLT fluctuation because the amount of oxygen precipitates after denuded zone formation is strongly related to the initial oxygen concentration in the wafer and this makes the MCLT value liable to be affected even for tiny initial oxygen difference. A gate oxide recipe is suggested to be adopted for MCLT monitoring in furnace performing denuded zone formation to circumvent the problem. For the gate oxide recipe, not only is the monitoring result stable but it is feasible to produce MCLT test wafers with real products without sacrificing tool productivity.
  • Keywords
    furnaces; integrated circuit manufacture; monitoring; denuded zone formation; furnaces; gate oxide recipes; inline minority carrier lifetime monitoring; metal contamination; minority carrier lifetime measurement; tool productivity; Charge carrier lifetime; Fluctuations; Furnaces; Monitoring; Performance evaluation; Pollution measurement; Productivity; Protection; Surface contamination; Systems engineering and theory; Denuded zone; gate oxide; metal contamination; minority carrier lifetime (MCLT); oxygen precipitates;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2008.2000284
  • Filename
    4512069