Title : 
Microstructured Optical Fiber for Residual Dispersion Compensation Over 
 
  Wavelength Bands
 
         
        
            Author : 
Franco, Marcos A R ; Serrão, Valdir A. ; Sircilli, Francisco
         
        
            Author_Institution : 
Inst. de Estudos Avancados (IEAv), Sao Jose dos Campos
         
        
        
        
        
            fDate : 
5/1/2008 12:00:00 AM
         
        
        
        
            Abstract : 
A defected-core microstructured optical fiber (MOF) is numerically investigated for the purpose of residual chromatic dispersion compensation from telecom link. The designed MOF exhibits ultraflattened negative dispersion over S + C + L + U wavelength bands and average dispersion of about -179 ps/nm/km with an absolute dispersion variation of 2.1 ps/nm/km from 1.480 to 1.675 mum (195-nm bandwidth). The designed fiber has eight rings of holes in the cladding resulting in low confinement loss of ~0.002 dB/km at 1.55 mum, and small effective mode area ~6 mum2. To evaluate the feasibility of such proposed MOF, a dimensional sensitivity analysis and an evaluation of coupling efficiency between the designed fiber and a conventional single-mode fiber have been carried out.
         
        
            Keywords : 
optical design techniques; optical fibre cladding; optical fibre communication; optical fibre couplers; optical fibre dispersion; optical fibre losses; optical links; cladding holes; confinement loss; coupling efficiency; defected-core microstructured optical fiber; effective mode area; residual chromatic dispersion compensation; telecom link; ultraflattened negative dispersion; wavelength 1.480 mum to 1.675 mum; Bandwidth; Central air conditioning; Chromatic dispersion; Lattices; Optical fiber communication; Optical fiber devices; Optical fiber dispersion; Optical fibers; Photonic crystal fibers; Telecommunications; Optical fiber; optical fiber dispersion; photonic crystal fiber;
         
        
        
            Journal_Title : 
Photonics Technology Letters, IEEE
         
        
        
        
        
            DOI : 
10.1109/LPT.2008.921085