DocumentCode :
1212155
Title :
A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages With Large Number of Vias
Author :
Oo, Zaw Zaw ; Liu, En-Xiao ; Li, Er-Ping ; Wei, Xingchang ; Zhang, Yaojiang ; Tan, Mark ; Li, Le-Wei Joshua ; Vahldieck, Rüdiger
Author_Institution :
Dept. of Electromagn. & Electron. Syst., Nat. Univ. of Singapore, Singapore
Volume :
31
Issue :
2
fYear :
2008
fDate :
5/1/2008 12:00:00 AM
Firstpage :
267
Lastpage :
274
Abstract :
This paper presents a semi-analytical approach for electrical performance modeling of complex electronic packages with multiple power/ground planes and large number of vias. The method is based on the modal expansion technique and the method of moments. For the inner package domain with multiple power/ground planes and many vias, the modal expansion method is employed to compute the electromagnetic fields from which the multiport network parameters, e.g., the admittance matrix can be easily obtained. For the top/bottom domain of signal layers, the moment method is used to extract the equivalent resistance, inductance, capacitance, and conductance (RLCG) parameters. The equivalent circuit for the entire package is then generated by combining the results for both package domains. The equivalent circuit can be used in a SPICE-like simulator to study the signal and power integrity of an electronic package. Numerical examples demonstrate that the new approach is able to provide fast yet accurate signal and power integrity analysis of multilayered electronic packages.
Keywords :
electromagnetic fields; electronics packaging; equivalent circuits; method of moments; SPICE simulator; admittance matrix; electromagnetic fields; electronic packages; equivalent circuit; method-of-moments; modal expansion technique; multiple power/ground planes; multiport network parameters; power integrity analysis; system-level electrical modeling; Admittance; Capacitance; Circuit simulation; Computer networks; Electromagnetic fields; Electronics packaging; Equivalent circuits; Inductance; Moment methods; Power system modeling; Electronic package; modal expansion; power integrity; signal integrity; system-level modeling;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2008.923379
Filename :
4512110
Link To Document :
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