• DocumentCode
    1214140
  • Title

    Special section on components and packaging technologies with contributions from ITherm 2002 thermal management track

  • Author

    Amon, C.H. ; Ramakrishna, K. ; Sammakia, Bahgat G. ; Joshi, Yogendra K.

  • Author_Institution
    Carnegie Mellon University
  • Volume
    26
  • Issue
    1
  • fYear
    2003
  • fDate
    3/1/2003 12:00:00 AM
  • Firstpage
    3
  • Lastpage
    5
  • Keywords
    Electronic packaging thermal management; Electronics cooling; Heat pumps; Heat sinks; Resistance heating; Special issues and sections; Technology management; Thermal conductivity; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2003.810756
  • Filename
    1202897
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1214140