• DocumentCode
    1214171
  • Title

    A review of selected thermal management solutions for military electronic systems

  • Author

    Price, Donald C.

  • Author_Institution
    Raytheon Network Centric Syst., McKinney, TX, USA
  • Volume
    26
  • Issue
    1
  • fYear
    2003
  • fDate
    3/1/2003 12:00:00 AM
  • Firstpage
    26
  • Lastpage
    39
  • Abstract
    Thermal management of electronics is vital to the successful design, manufacture, and tactical operation of a variety of military electronic systems. Designs employ all modes of heat transfer including: conduction, natural and forced convection, aerodynamic heating, radiation, and two-phase heat transfer. A variety of heat sinks and heat exchange devices are employed, including the use of cold plates, electronic chassis coldwalls, compact heat exchangers, air-cycle and vapor-cycle refrigeration systems, phase change materials, thermoelectric devices, and heat pipes. This paper describes several military electronic systems on a variety of platforms and discusses the thermal management issues involved in the design of the thermal control systems. Specific examples are employed in the paper to emphasize the variety of thermal management problems encountered and the solution techniques employed.
  • Keywords
    cooling; forced convection; heat conduction; heat exchangers; heat pipes; heat radiation; heat sinks; military equipment; military systems; natural convection; phase transformations; refrigeration; reviews; thermal management (packaging); aerodynamic heating; air-cycle refrigeration; cold plates; compact heat exchangers; conduction; electronic chassis coldwalls; forced convection; heat pipes; military electronic systems; natural convection; phase change materials; radiation; tactical operation; thermal control systems; thermal management issues; thermoelectric devices; two-phase heat transfer; vapor-cycle refrigeration; Aerodynamics; Cold plates; Heat sinks; Heat transfer; Manufacturing; Phase change materials; Refrigeration; Thermal management; Thermal management of electronics; Thermoelectric devices;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2003.811464
  • Filename
    1202900