DocumentCode
1214287
Title
Special section on compact thermal modeling
Author
Lasance, C.
Author_Institution
Philips Research Laboratories
Volume
26
Issue
1
fYear
2003
fDate
3/1/2003 12:00:00 AM
Firstpage
134
Lastpage
135
Keywords
Heat sinks; Packaging; Product design; Semiconductor device manufacture; Software design; Software tools; Special issues and sections; Standardization; Temperature; Virtual manufacturing;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.814000
Filename
1202912
Link To Document