• DocumentCode
    1214356
  • Title

    Compact thermal models for electronic systems

  • Author

    Sabry, Mohamed-Nabil

  • Author_Institution
    Mentor Graphics, Cairo, Egypt
  • Volume
    26
  • Issue
    1
  • fYear
    2003
  • fDate
    3/1/2003 12:00:00 AM
  • Firstpage
    179
  • Lastpage
    185
  • Abstract
    Compact thermal models have been constructed for different levels in electronic systems with a variable degree of success. In this work first steps toward constructing a unifying theory are presented for linear systems giving general constraints on the form of the compact model that will ensure an adequate description of thermal systems. The theory is also used to study the completeness of the set of boundary conditions used to derive and/or validate thermal compact models.
  • Keywords
    heat transfer; modelling; printed circuits; thermal analysis; thermal management (packaging); PCB; boundary conditions; compact thermal models; electronic systems; linear systems; packaging; thermal management; thermal systems; unifying theory; Boundary conditions; Constraint theory; Electronic packaging thermal management; Fluid dynamics; Heat transfer; Linear systems; Printed circuits; Thermal conductivity; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2002.808009
  • Filename
    1202918