DocumentCode
1214356
Title
Compact thermal models for electronic systems
Author
Sabry, Mohamed-Nabil
Author_Institution
Mentor Graphics, Cairo, Egypt
Volume
26
Issue
1
fYear
2003
fDate
3/1/2003 12:00:00 AM
Firstpage
179
Lastpage
185
Abstract
Compact thermal models have been constructed for different levels in electronic systems with a variable degree of success. In this work first steps toward constructing a unifying theory are presented for linear systems giving general constraints on the form of the compact model that will ensure an adequate description of thermal systems. The theory is also used to study the completeness of the set of boundary conditions used to derive and/or validate thermal compact models.
Keywords
heat transfer; modelling; printed circuits; thermal analysis; thermal management (packaging); PCB; boundary conditions; compact thermal models; electronic systems; linear systems; packaging; thermal management; thermal systems; unifying theory; Boundary conditions; Constraint theory; Electronic packaging thermal management; Fluid dynamics; Heat transfer; Linear systems; Printed circuits; Thermal conductivity; Thermal management; Thermal resistance;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2002.808009
Filename
1202918
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