DocumentCode
1214377
Title
Microwave-transmission, heat and temperature properties of electrically conductive adhesive
Author
Fu, Ying ; Wang, T. ; Liu, Johan
Author_Institution
Dept. of Phys., Chalmers Univ. of Technol., Gothenburg, Sweden
Volume
26
Issue
1
fYear
2003
fDate
3/1/2003 12:00:00 AM
Firstpage
193
Lastpage
198
Abstract
Microwave heating significantly speeds up the curing process of polymer and polymer-based composites. The present theoretical work studies the microwave transmission through the electrically conductive adhesive (ECA), heat generation and transfer inside the ECA and subsequently the microwave heating rate of the ECA. By studying the temporal transmission property of the microwaves in the ECA, we have calculated quantitatively the electromagnetic field distribution around a metal filler. It has been shown that the penetration depth of the skin effect in the metal filler is significantly smaller than the one of a bulk metal material. The heat generation (microwave power absorption) is negligible in the metal filler due to its large electric conductivity. Furthermore, due to the high thermal conductivity, the thermal equilibrium between the metal filler and the surrounding adhesive is reached within a nano second (10-9 s). The temperature of the whole ECA system becomes uniform within a time interval of 10-3 s. When the temperature of the system is relatively low, the heating rate of the system is linearly proportional to the external microwave input power and the heating time. It gradually saturates when the temperature of the ECA is so high that the heat radiation from the ECA becomes significant. Numerical results of our theoretical model agree well with experimental data, thus providing a solid platform for designing the microwave curing process of the ECA.
Keywords
adhesives; conducting polymers; electromagnetic fields; electromagnetic wave transmission; filled polymers; heat transfer; microwave heating; packaging; skin effect; thermal analysis; thermal conductivity; 1E-3 s; 1E-9 s; electrically conductive adhesive; electromagnetic field distribution; heat generation; heat radiation; heat transfer; metal filler; microwave curing process; microwave heating rate; microwave power absorption; microwave transmission; penetration depth; polymer-based composites; skin effect; temporal transmission property; theoretical model; thermal conductivity; Conductive adhesives; Curing; Electromagnetic fields; Electromagnetic heating; Heat transfer; Microwave generation; Polymers; Resistance heating; Temperature; Thermal conductivity;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2002.806179
Filename
1202920
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