Title :
Design aspects of planar and conventional SMPS transformer: a cost benefit analysis
Author :
Maswood, Ali I. ; Song, Lim Keng
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
fDate :
6/1/2003 12:00:00 AM
Abstract :
The intent of this paper is to design a high-frequency transformer that is to be incorporated into the DC/DC pulsewidth-modulated switch-mode power supplies by two different technical approaches: a conventional wound-coil magnetic using copper wires, and a planar magnetic with layered copper tracks on laminated printed circuit board. Comparisons will be made between the two approaches in terms of profile: mounting height and surface area, and performance: power losses and efficiency. Other indicators like temperature rise and leakage inductance that causes electromagnetic interference, and cost, materials, and process fluency are also to be looked into. A sandwiched configuration for primary and secondary windings is proposed for the planar type. Issues arising and typical phenomena encountered will be discussed in detail. Primarily, the dominating factor in performance, cost effectiveness, or circuit compactness that restrains the choice of a particular type is to be evaluated.
Keywords :
DC-DC power convertors; PWM power convertors; high-frequency transformers; power transformers; switched mode power supplies; transformer cores; transformer windings; DC/DC PWM SMPS; copper wires; efficiency; electromagnetic interference; high-frequency transformer; laminated printed circuit board; layered copper tracks; leakage inductance; mounting height; performance; planar magnetic; power losses; primary windings; sandwiched configuration; secondary windings; surface area; temperature rise; wound-coil magnetic; Copper; Cost benefit analysis; Magnetic switching; Printed circuits; Pulse circuits; Pulse transformers; Pulsed power supplies; Switched-mode power supply; Switching circuits; Wires;
Journal_Title :
Industrial Electronics, IEEE Transactions on
DOI :
10.1109/TIE.2003.812469