Title :
Building blocks for back-junction back-contacted cells and modules with ion-implanted poly-Si junctions
Author :
Peibst, Robby ; Romer, Udo ; Larionova, Yevgeniya ; Schulte-Huxel, Henning ; Ohrdes, Tobias ; Haberle, Michael ; Lim, B. ; Krugener, Jan ; Stichtenoth, Daniel ; Wutherich, Tobias ; Schollhorn, Claus ; Graff, John ; Brendel, Rolf
Author_Institution :
Inst. for Solar Energy Res. Hamelin (ISFH), Emmerthal, Germany
Abstract :
We propose a process for a back-junction back-contacted solar cell (including module interconnection) combining a high efficiency potential and a lean process flow. This structure offers potential for (i) a high Jsc - no optical shading losses due to the absence of front-side metallization and minimized absorption losses at the cell front-side, (ii) a high Voc - excellent passivation including “passivated contacts” based on poly-Si/c-Si junctions, and (iii) a high FF - large area contacts with low contact resistance and the absence of busbar losses due to a two-layer metallization. A lean process flow becomes feasible by utilizing two enabling technologies - in situ patterned ion implantation and module interconnection by laser welding (AMELI). We present experimental results for the main building blocks: (1) Patterned ion implantation yields an excellent recombination behavior homogeneously on 6", (2) Ion-implanted poly-Si / c-Si junctions enabling Voc values up to 742 mV and J0e values down to 1.3fA/cm2, (3) Al2O3 front-side passivation enabling Jsc values up to 41.8 mA/cm2 and IQE values > 1 for λ <; 350 nm, and (4) busbarless, silver-free AMELI two-layer interconnection. As an intermediate step, we fabricated ion-implanted BJBC cells with conventional junctions and metallization with efficiencies up to 22.1% on 6".
Keywords :
alumina; elemental semiconductors; ion implantation; metallisation; passivation; silicon; solar cells; Al2O3; BJBC cells; Si; back-junction back-contacted solar cell; building blocks; busbarless; front-side passivation; high efficiency potential; ion-implanted poly-junctions; lean process flow; module interconnection; passivated contacts; patterned ion implantation; recombination behavior; silver-free AMELI two-layer interconnection; two-layer metallization; Ion implantation; Junctions; Metallization; Passivation; Photovoltaic cells; Radiative recombination; Silicon; Ion implantation; Photovoltaic cell; Silicon; Solar energy; back contact solar cells; module-level interconnection;
Conference_Titel :
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location :
Denver, CO
DOI :
10.1109/PVSC.2014.6925049