• DocumentCode
    1215682
  • Title

    A new class of single event hard errors [DRAM cells]

  • Author

    Swift, Gary M. ; Padgett, Dwayne J. ; Johnston, Allan H.

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • Volume
    41
  • Issue
    6
  • fYear
    1994
  • Firstpage
    2043
  • Lastpage
    2048
  • Abstract
    Experimental results reported here indicate that heavy ions can cause hard errors in conventional one-transistor dynamic memory cells in addition to, as previously reported, four-transistor static cells. Analysis of this data reveals that the hard errors fail into two classes, one that is consistent with the expected single-ion dose mechanism and another that is clearly inconsistent. In particular, the new class of hard errors is separable from the dosed cells based on irradiation conditions and the data-loss time scale and direction. Further, this damage is not additive between ion hits, does not follow "effective" LET, and is quite resistant to annealing. As a result these hard errors would accumulate over long missions and assuming the damaged element is the access transistor, can be expected in other types of storage elements with similar transistors, e.g., static RAMs and microprocessor registers. Additionally, it was found that scaling increases the susceptibility for a given ion and lowers the ion threshold, although lowered bias mitigates the damage.<>
  • Keywords
    DRAM chips; errors; ion beam effects; dynamic RAM; dynamic memory cells; heavy ions; ion threshold; one-transistor DRAM cells; scaling; single event hard errors; single-ion dose mechanism; Annealing; Capacitors; DRAM chips; Laboratories; Microprocessors; Propulsion; Random access memory; Registers; Space technology; Testing;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.340540
  • Filename
    340540