• DocumentCode
    1215761
  • Title

    Simplified Macromodel of MTLs With Incident Fields (SiMMIF)

  • Author

    Shinh, Gurpreet S. ; Achar, Ramachandra ; Nakhla, Natalie M. ; Nakhla, Michel S. ; Erdin, Ihsan

  • Author_Institution
    Nvidia Corp., Santa Clara, CA
  • Volume
    50
  • Issue
    2
  • fYear
    2008
  • fDate
    5/1/2008 12:00:00 AM
  • Firstpage
    375
  • Lastpage
    389
  • Abstract
    Electromagnetic compatibility (EMC) analysis of high-speed designs has become imperative due to rapidly increasing radio-frequency interference and emerging technological trends such as higher operating frequencies, denser layouts, and multifunction convergent products. In this paper, a simplified macromodel of multiconductor transmission lines (MTLs) exposed to incident fields is presented. The proposed formulation can also handle frequency dependence of resistance, capacitance, conductance, and inductance (RLGC) line parameters. The method employs the recently developed delay-extraction-based compact and passive MTL macromodel, while developing closed-form expressions for incident field analysis. An error bound for the proposed macromodel is also presented. The macromodel is simulation program with integrated circuit emphasis (SPICE) compatible and overcomes the mixed frequency/time simulation difficulties usually encountered during transient analysis, while guaranteeing the stability of the global transient simulation. The algorithm provides higher accuracy as well as significant speed gains for EMC analysis of transmission line networks as compared to the existing techniques.
  • Keywords
    SPICE; circuit simulation; electromagnetic compatibility; multiconductor transmission lines; radiofrequency interference; EMC analysis; MTL macromodel; electromagnetic compatibility; high-speed design; incident field analysis; integrated circuit emphasis; multiconductor transmission line; radio-frequency interference; transient analysis; transmission line network; Analytical models; Circuit simulation; Electromagnetic analysis; Electromagnetic compatibility; Electromagnetic compatibility and interference; Multiconductor transmission lines; Radio frequency; Radiofrequency interference; SPICE; Transient analysis; Circuit simulation; delay extraction; distributed interconnects; electromagnetic coupling; electromagnetic interference (EMI); high-speed modules; incident fields; method of characteristics (MoC); multiconductor transmission lines (MTLs); passive macromodels; printed circuit boards (PCBs); transient ; transient analysis;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2008.922788
  • Filename
    4517025