DocumentCode
1217374
Title
A self-retracting fully compliant bistable micromechanism
Author
Masters, Nathan D. ; Howell, Larry L.
Author_Institution
Brigham Young Univ., Provo, UT, USA
Volume
12
Issue
3
fYear
2003
fDate
6/1/2003 12:00:00 AM
Firstpage
273
Lastpage
280
Abstract
A new class of fully compliant bistable mechanisms with the added benefit of integrated self-retraction has been developed (hereafter identified as Self-Retracting Fully compliant Bistable Mechanism or SRFBM). A technique using tensural pivots to manage compressive loading in compliant mechanisms is introduced and implemented in the SRFBM. The elimination of traditional kinematic joints and their associated clearance allows a total displacement between stable positions of 8.5 μm, and the mechanism size is less than 300 μm square when using 2.0 μm minimum line widths. Maximum actuation force is approximately 500 μN. The SRFBM´s small linear displacement and reasonable actuation force facilitate integration with efficient thermal actuators. Furthermore, fully compliant mechanisms allow greater freedom in fabrication as only one mechanical layer is needed. Systems with on-chip actuation have been fabricated and tested, demonstrating bistability and on-chip actuation, which requires approximately 150 mW. A single fatigue test has been completed, during which the SRFBM endured approximately 2 million duty cycles without failure.
Keywords
fatigue testing; mechanical stability; microactuators; microswitches; 150 mW; 2.0 micron; 300 micron; SRFBM; Si; bistability; compressive loading; fully compliant bistable mechanisms; integrated self-retraction; kinematic joint elimination; low-power switching; maximum actuation force; mechanism size; minimum line widths; on-chip actuation; polysilicon; self-retracting fully compliant bistable micromechanism; single fatigue test; small linear displacement; tensural pivots; thermal actuator integration; total displacement; Fabrication; Hydraulic actuators; Kinematics; Micromechanical devices; Microswitches; Nonvolatile memory; Residual stresses; System testing; System-on-a-chip; Thermal force;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2003.811751
Filename
1203765
Link To Document