• DocumentCode
    1218749
  • Title

    Foreword

  • Author

    Chandra, Aniruddha ; Fan, Xiaodan

  • Volume
    31
  • Issue
    2
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    243
  • Lastpage
    244
  • Abstract
    The seven papers in this special section focus on delamination and cracking in electronic devices during assembly, packaging and reliability testing conditions. The papers are selected from the presentations of conferences organized under the auspices of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society.
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2008.923442
  • Filename
    4520012
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1218749