Title :
Scaling Analysis of Performance Tradeoffs in Electronics Cooling
Author :
Green, Craig E. ; Fedorov, Andrei G. ; Joshi, Yogendra K.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Using the governing equations for internal fluid flow and heat transfer, scaling laws are developed to predict how the selection of a liquid or gas coolant and geometry affects the pumping power and volume requirements of heat sinks in electronics cooling applications. One of the principal outcomes of the presented scaling analysis is derivation, based on first principles, of new figure-of-merit parameters that can be used to evaluate cooling performance and guide efforts on development of new cooling fluids. The new figures-of-merits are critically compared to existing performance metrics and experimental data from the literature to emphasize the relevance and accuracy of developed scaling laws.
Keywords :
cooling; heat sinks; scaling circuits; thermal management (packaging); electronics cooling; figure-of-merit parameters; geometry; heat sinks; heat transfer; internal fluid flow; pumping power; scaling analysis; thermal management; Liquid cooling; scaling; thermal management;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2009.2013720