• DocumentCode
    1218774
  • Title

    Thermal Optimal Design for Plain Plate-Fin Heat Sinks by Using Neuro-Genetic Method

  • Author

    Horng, Jenn-Tsong ; Chang, Shih-Fong ; Wu, Tau-Yuan ; Chen, Po-Li ; Hung, Ying-Huei

  • Author_Institution
    Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu
  • Volume
    31
  • Issue
    2
  • fYear
    2008
  • fDate
    6/1/2008 12:00:00 AM
  • Firstpage
    449
  • Lastpage
    460
  • Abstract
    An effective artificial neural network together with a genetic algorithm have been demonstrated for predicting the optimal thermal performance of plain plate-fin heat sinks in a ducted flow under multi-constraints such as pressure drop, mass, and space limitations. A series of constrained optimal designs can be efficiently performed. Comparisons of the optimal results between the artificial neural network with genetic algorithm (ANN-GA) and the response surface methodology with sequential quadratic programming (RSM-SQP) methods are made. Although more training patterns are needed for the ANN-GA method as compared to that for the RSM-SQP method, the ANN-GA method which has randomly uniform-distributed training patterns in the whole solving domain can be applied to the global region of interest, not just in the region of operability. Consequently, a globally precise optimal solution can be achieved with the ANN-GA method; while the solution obtained with the RSM-SQP method may cause a significant error if the optimal values of the design variables happen to be located beyond the region of operability.
  • Keywords
    electronic engineering computing; genetic algorithms; heat sinks; neural nets; quadratic programming; response surface methodology; artificial neural network; ducted flow; genetic algorithm; neuro-genetic method; plain plate-fin heat sinks; pressure drop; response surface methodology; sequential quadratic programming; thermal optimal design; uniform-distributed training; Artificial neural network with genetic algorithm (ANN-GA) method; plain plate-fin heat sink; pressure drop; response surface methodology with sequential quadratic programming (RSM-SQP) method; thermal optimal design; thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2008.921644
  • Filename
    4520015