Title :
Thermal Optimal Design for Plain Plate-Fin Heat Sinks by Using Neuro-Genetic Method
Author :
Horng, Jenn-Tsong ; Chang, Shih-Fong ; Wu, Tau-Yuan ; Chen, Po-Li ; Hung, Ying-Huei
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu
fDate :
6/1/2008 12:00:00 AM
Abstract :
An effective artificial neural network together with a genetic algorithm have been demonstrated for predicting the optimal thermal performance of plain plate-fin heat sinks in a ducted flow under multi-constraints such as pressure drop, mass, and space limitations. A series of constrained optimal designs can be efficiently performed. Comparisons of the optimal results between the artificial neural network with genetic algorithm (ANN-GA) and the response surface methodology with sequential quadratic programming (RSM-SQP) methods are made. Although more training patterns are needed for the ANN-GA method as compared to that for the RSM-SQP method, the ANN-GA method which has randomly uniform-distributed training patterns in the whole solving domain can be applied to the global region of interest, not just in the region of operability. Consequently, a globally precise optimal solution can be achieved with the ANN-GA method; while the solution obtained with the RSM-SQP method may cause a significant error if the optimal values of the design variables happen to be located beyond the region of operability.
Keywords :
electronic engineering computing; genetic algorithms; heat sinks; neural nets; quadratic programming; response surface methodology; artificial neural network; ducted flow; genetic algorithm; neuro-genetic method; plain plate-fin heat sinks; pressure drop; response surface methodology; sequential quadratic programming; thermal optimal design; uniform-distributed training; Artificial neural network with genetic algorithm (ANN-GA) method; plain plate-fin heat sink; pressure drop; response surface methodology with sequential quadratic programming (RSM-SQP) method; thermal optimal design; thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2008.921644