DocumentCode :
1219443
Title :
Controlled Intersymbol Interference Design Techniques of Conventional Interconnect Systems for Data Rates Beyond 20 Gbps
Author :
Beyene, Wendemagegnehu T. ; Amirkhany, Amir
Author_Institution :
Rambus Inc., Los Altos, CA
Volume :
31
Issue :
4
fYear :
2008
Firstpage :
731
Lastpage :
740
Abstract :
This paper presents a new design technique of high-speed interconnects with controlled intersymbol interference (ISI) to create efficient signaling over a band-limited channel. Performance of high-speed electrical links is limited by conductor loss, dielectric dispersion, and reflections in the board, package, and connector. These nonidealities result in significant ISI. In current systems, the effect of ISI is either mitigated through complex equalization, signal conditioning, and coding techniques, or through costly impedance control and manufacturing processes. In the proposed approach, instead of eliminating ISI, we shape the response of the channel into a set of channel characteristics with controlled ISI using simple passive structures in the board and the package. The resulting controlled ISI is exploited at the transmitter and receiver to simplify the architecture of the system and to achieve high data rates. The techniques to design interconnects with controlled ISI are reasonably simple to implement in conventional interconnect technologies. Simulation examples are given to demonstrate the validity and advantages of the design technique using duobinary and analog multitone (AMT) signaling methods.
Keywords :
bandlimited communication; equalisers; intersymbol interference; telecommunication channels; analog multitone signaling methods; band-limited channel; coding techniques; complex equalization; conductor loss; controlled intersymbol interference design techniques; conventional interconnect systems; dielectric dispersion; high-speed interconnects; signal conditioning; Analog multitone (AMT) signaling; doubinary signaling; intersymbol interference (ISI); partial response signaling;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2008.924224
Filename :
4520266
Link To Document :
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