Title :
Semiconducting carbon single-walled nanotubes as a cu-free, barrier-free back contact for CdTe solar cell
Author :
Khanal, Rajendra R. ; Phillips, Adam B. ; Zhaoning Song ; Plotnikov, Victor V. ; Carter, Chad W. ; Stayancho, John M. ; Heben, Michael J.
Author_Institution :
Dept. of Phys. & Astron., Univ. of Toledo, Toledo, OH, USA
Abstract :
Copper diffusion from the back contact degrades the performance of CdTe solar cells over time and increases the levelized cost of electricity production from CdTe photovoltaics. Recently, carbon single-wall nanotubes (SWNTs) were shown to be a Cu-free, stable alternative that preserves the device efficiency (Phillips et al., Nano Letter, 2013). Large diameter tube samples containing a mixture of semiconducting (s-SWNT) and metallic (m-SWNT) species were used in the previous work, and the mechanisms leading to a low back barrier for majority carrier flow were not clear. The good performance of the back contact was ascribed to the interaction between the s-SWNTs in the film and the polycrystalline facets of the CdTe surfaces. In that case, the s-SWNT species had small bandgaps (~0.6-0.8 eV). Here, in an attempt to develop a more detailed understanding of the SWNT/CdTe back contact, we employed SWNT samples that are predominantly semiconducting (95%) and of larger bandgap (~1.1-1.3 eV). The power conversion efficiency of these unoptimized devices was 11.5 % with a s-SWNT back contact, as compared to 11.2% with a standard Cu/Au back contact.
Keywords :
carbon nanotubes; solar cells; bandgap; copper diffusion; copper-free barrierfree back contact; electricity production; metallic-SWNT; photovoltaics; polycrystalline facets; power conversion; semiconducting carbon single-walled nanotubes; semiconducting-SWNT; solar cell; Annealing; Films; Gold; Performance evaluation; Photonic band gap; Photovoltaic cells; CdTe; back contact; carbon single wall nanotube; efficiency; open circuit voltage; photovoltaic cells;
Conference_Titel :
Photovoltaic Specialist Conference (PVSC), 2014 IEEE 40th
Conference_Location :
Denver, CO
DOI :
10.1109/PVSC.2014.6925398