Title :
Teleoperated touch feedback from the surfaces at the nanoscale: modeling and experiments
Author :
Sitti, Metin ; Hashimoto, Hideki
Author_Institution :
Dept. of Mech. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fDate :
6/1/2003 12:00:00 AM
Abstract :
In this paper, a teleoperated nanoscale touching system is proposed, and continuum nanoscale contact mechanics models are introduced. The tele-nanorobotic system consists of a piezoresistive nanoprobe with a sharp tip as the nanorobot and force-topology sensor, a custom-made 1-degree-of-freedom haptic device for force-feedback, three-dimensional (3D) virtual reality (VR) graphics display of the nano world for visual feedback, and a force-reflecting servo type scaled teleoperation controller. Using this system, one-dimensional and 3D touching experiments and VR simulations are realized. Scaling of nano-forces is one of the major issues of the scaled teleoperation system since nanometer scale forces are dominated by surface forces instead of inertial forces as in the macro world. As the force scaling approach, a heuristic rule is introduced where nano-forces are linearly scaled with an experimentally determined scaling parameter. Simulation results and preliminary experiments of touching silicon and InAs quantum dot nanostructures show that adhesion forces at the nanoscale can be felt repeatedly at the operator´s hand, and the proposed system enables the nanoscale surface topography and contact/noncontact nano-force feedback.
Keywords :
force feedback; force sensors; haptic interfaces; microrobots; nanotechnology; piezoelectric transducers; telerobotics; virtual reality; force sensor; graphics display; haptic feedback; nano mechanics; nano robotics; nanomanipulation; nanotechnology; piezoresistive nanoprobe; telerobotics; touch feedback; virtual reality; Force feedback; Graphics; Haptic interfaces; Nanoscale devices; Piezoresistance; Sensor systems; Servomechanisms; Surface topography; Three dimensional displays; Virtual reality;
Journal_Title :
Mechatronics, IEEE/ASME Transactions on
DOI :
10.1109/TMECH.2003.812828