DocumentCode :
1221470
Title :
Reliability of pressure-sensitive adhesive tapes for heat sink attachment in air-cooled electronic assemblies
Author :
Eveloy, Valerie ; Rodgers, Peter ; Pecht, Michael G.
Author_Institution :
CALCE Electron. Products & Syst. Center, Univ. of Maryland, College Park, MD, USA
Volume :
4
Issue :
4
fYear :
2004
Firstpage :
650
Lastpage :
657
Abstract :
This study investigates the reliability of commercially available pressure-sensitive adhesive (PSA) tapes used for electronic component-to-heat sink attachment. It is found that creep can affect the PSA reliability. Therefore, creep is experimentally characterized using isothermal, constant load, double lap shear measurements in conditions representative of vertically oriented heat sink applications. PSA joint life predictions are derived from the accelerated creep characteristics using a secondary creep model. The creep resistance of a laminated silicone/aluminum/acrylic PSA tape is found to be significantly lower than that of a single-layer acrylic tape. This suggests that the potential impact of tape creep on joint reliability should be carefully evaluated as a function of tape chemistry/construction and application environment. Furthermore, the sensitivity of PSA creep characteristics to both operating temperature and heat sink weight highlights the need for thermally optimized, least-weight heat sink designs.
Keywords :
adhesive bonding; adhesives; creep; heat sinks; materials testing; reliability; air-cooling; ape chemistry; constant load measurements; creep characteristics; creep model; creep resistance; double lap shear measurements; electronic assembly; heat sink; isothermal measurements; joint reliability; laminated silicone/aluminum/acrylic PSA tape; pressure-sensitive adhesive tapes; reliability prediction; single-layer acrylic tape; tape construction; tape creep; thermal interface material; Acceleration; Aluminum; Assembly; Chemistry; Creep; Electrical resistance measurement; Heat sinks; Isothermal processes; Predictive models; Temperature sensors;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2004.838394
Filename :
1388436
Link To Document :
بازگشت